FSH AOI (Advanced Packaging)
CBX2200
CBX2200 offers a large-area inspection solution. It is suitable for large-area inspection such as semiconductor wafers, displays, PCB panels, etc. for 3D inspection, and it allows fast and precise inspection free from restrictions due to the material form.
Specification
- Applicable Material
- 300mm Wafer / 400mm Ring Frame FOUP&FOSE, Cassette
- Wafer Stage
-
Core Less Linear Servo Motor
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Axis Stroke
X-Axis Stroke : 0~650 mm
Y-Axis Stroke : 0~650 mm -
Resolution
10nm
-
Velocity[MAX]
200mm/s
-
Maximum Load
20 Kg
-
Accuracy
±1.5um (After Calibration)
-
Repeatability
±0.5um
-
Straightness / Flatness
±1.5um
- CBX2200
-
Laser Wavelength
532nm
-
Focus Lens
5X, 10X, 20X, 50X
-
Optical Resolution
2um, 1um, 0.7um, 0.5um
-
Input Power
220V 1Phase / 10A